Kaynes Circuits is being developed as the Group’s advanced bare-board PCB manufacturing platform. It strengthens Kaynes’ participation at a foundational stage of electronics manufacturing and supports the company’s move toward a more integrated electronics value chain.

Planned capabilities include advanced multilayer PCBs, High-Density Interconnect boards and specialized PCB technologies for complex electronic applications. The platform is intended to serve demanding sectors such as aerospace, defense, telecommunications, artificial intelligence, medical electronics, automotive systems, industrial equipment and consumer devices.

By connecting PCB manufacturing with Kaynes’ established EMS, system-integration and testing capabilities, Kaynes Circuits can improve coordination between board fabrication and product manufacturing. It also supports domestic value creation, greater supply-chain visibility and reduced dependence on imported high-complexity PCBs.