Kaynes Semicon is building an advanced semiconductor backend platform in India for semiconductor assembly, packaging, testing and reliability engineering. Its purpose is to help semiconductor technologies move from device development into qualified, industrial-scale manufacturing.

The platform spans packaging technology, process engineering, Outsourced Semiconductor Assembly and Test, post-silicon engineering, reliability assessment, failure analysis, system solutions and design-led development. Its packaging roadmap covers discrete packages, advanced semiconductor modules, Multi-Chip Modules, System-in-Package solutions and test-validation services for power electronics, industrial systems and emerging compute applications.

Kaynes Semicon extends the Group’s participation from electronics manufacturing into semiconductor backend operations. Its phased Sanand platform combines pilot capability with expanding cleanroom and production infrastructure. Within the wider Kaynes ecosystem, this creates closer alignment between semiconductor packaging, PCB assemblies, system integration and complete electronic products.