Kaynes is expanding from its established Electronics Manufacturing Services base into a more integrated electronics platform. The model connects advanced PCB manufacturing, core EMS capabilities and semiconductor assembly, packaging and testing.
This integration is designed to increase participation across the electronics value chain, strengthen supply-chain visibility and connect critical manufacturing stages within the Kaynes ecosystem.
Kaynes is investing in advanced multilayer and High-Density Interconnect PCB manufacturing through Kaynes Circuits. This capability extends the Group into bare-board fabrication, a foundational stage in the production of complex electronic systems.
Closer coordination between PCB fabrication and electronics assembly can support supply-chain control, domestic value creation and manufacturing readiness for high-complexity applications. The platform is being developed for sectors such as aerospace, defense, telecommunications, automotive, medical, industrial and advanced computing.
Electronics Manufacturing Services remain the core of Kaynes’ operating platform. Capabilities span PCB assembly, cable harnesses, system integration, box build, testing and complete product manufacturing.
This established manufacturing base connects engineering and industrialization with repeatable production. It also provides the foundation through which PCB and semiconductor capabilities can be integrated into finished electronic assemblies and systems.
Through Kaynes Semicon, the Group is developing semiconductor assembly, advanced packaging, testing, post-silicon engineering and reliability capabilities. The phased Sanand platform supports Kaynes’ expansion into the semiconductor backend.
This capability moves Kaynes closer to the semiconductor layer of electronic products. When connected with PCB manufacturing and EMS, it creates a broader platform spanning packaged semiconductor devices, electronic assemblies and complete systems.