Through Kaynes Semicon, Kaynes is expanding into Outsourced Semiconductor Assembly and Test. The Sanand platform extends our participation into semiconductor assembly, advanced packaging and testing while connecting semiconductor devices with the wider Kaynes electronics ecosystem.
The Sanand facility has progressed from qualification to the commercial delivery of Multi-Chip Modules. Its technology roadmap includes increasingly advanced packaging formats such as Flip-Chip BGA and System-in-Package, supported by packaging engineering, testing and technology partnerships.
This capability moves Kaynes closer to semiconductor value creation and creates a more connected path from packaged devices to electronic assemblies and complete systems. It also strengthens domestic manufacturing capability and supply-chain resilience.
