Through Kaynes Circuits, Kaynes is developing advanced bare-board PCB manufacturing capabilities in Chennai. The facility extends our platform into a foundational layer of complex electronic products and strengthens backward integration across the electronics value chain.
The upcoming facility is engineered to manufacture multilayer High-Density Interconnect PCBs with configurations of up to 74 layers. It is being developed to support high-complexity applications across computing, telecommunications, aerospace and other demanding electronics sectors.
Connecting PCB fabrication with electronics assembly, system integration and semiconductor packaging can improve coordination across critical production stages. It is also intended to strengthen domestic sourcing, reduce dependence on imported high-complexity boards and provide customers with a more integrated manufacturing platform.
